# 识光芯科 / 芯片重新定义激光雷达 - ID: 387 - URL: https://www.stoyard.com/works/387 - English URL: https://www.stoyard.com/en/works/387 - Year: 2023 - Cover: https://static.glabcms.stoyard.com/stoyard/project/cover/20230816/ptkkiqkt8xm.png - Categories: 先进制造, 产品（Marketing）手册, 通信、芯片半导体, 品牌出海，跨境电商 - English Categories: Advanced Manufacturing, Marketing Manual, Semiconductors and Communications, Electronic Commerce - Author: 葛熙呈 - English Author: Xicheng Ge - Editor: Jackson - External Link: http://www.sophoton.com ## 中文主体 ### 项目简介 识光｜Sophoton 致力于为自动驾驶、机器人、XR等终端应用提供高性能、高可靠性和低成本的SPAD-SoC芯片及相关dToF三维感知技术。识光通过全芯片化和全数字化片上集成，大幅简化系统结构，帮助激光雷达突破现有的在性能、外形、可靠性和成本等方面的边界，以最终实现三维感知的广泛应用。 [Video](https://static.glabcms.stoyard.com/stoyard/gallery/20230811/x0jzpr302b.mp4) [Video](https://static.glabcms.stoyard.com/stoyard/gallery/20231222/8k6pca0h48a.mp4) SPAD-SoC芯片主要分为七大模块，高性能背照式SPAD阵列，高精度时钟采样矩阵，单光子测距引擎，高并发dToF感知算法加速器，激光发射控制器，激光雷达控制单元和高速数据接口。 我们对SPAD-SoC芯片的七大结构有了详细的认知后，产出了芯片的三维模型渲染与动画，配以高亮区域的示意和文字描述，旨在更加清晰,直观地展现芯片的每个部分。    ## English Content ### Introduction Sophoton is dedicated to providing high-performance, highly reliable and low-cost SPAD-SoC chips and related dToF 3D perception technologies for terminal applications such as autonomous driving, robotics, and XR. Through full-chip integration and full-digital on-chip integration, Sophoton significantly simplifies the system structure, helping LiDAR break through existing boundaries in terms of performance, form factor, reliability and cost, to ultimately achieve the wide application of 3D perception. [Video](https://static.glabcms.stoyard.com/stoyard/gallery/20230811/x0jzpr302b.mp4) [Video](https://static.glabcms.stoyard.com/stoyard/gallery/20231222/8k6pca0h48a.mp4)   